PROCESS & EQUIPMENT ENGINEER (PLATING & SAWING)

GLOBETRONICS SDN BHD

Full Time
Malaysia
Posted 3 months ago

TERMS AND CONDITIONS:

BASIC SALARY : 3,800

FREE ACCOMODATION

FREE TRANSPORTATION

FOOD INCLUDED IN THE OFFER

 

EDUCATION REQUIRED: Diploma in Engineering (Electronics, Electrical & Mechanical)

WORK EXPERIENCE: Minimum 5 (five) years working experience in Die Attach/Wire Bond/Dicing/Sawing/NPI Field


SKILLS & ABILITIES:

  • Knowledgeable in die attach, wire bonding, dicing, sawing, plating
  • Expertise in sawing
  • Expertise in plating
  • Able to work shift

 

NOTE:
Interested applicant you may send your resume/cv, scanned copy of passport, school credentials & employment certificate/s (if any). at workasia2017@gmail.com

Job Features

Job CategoryEngineering

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